With the development and progress of The Times, brittle materials are more and more widely used, including mobile phones, ipads, TELEVISIONS, computer displays, LED and OLED products and other microelectronic products, glass substrates of integrated circuits, optical devices, medical devices, semiconductors and so on.

With the continuous development and iteration of brittle materials, the use of more advanced laser technology for processing is particularly important in the field of micro-fine processing.

After years of technical precipitation, many methods have achieved experimental results under the continuous drive of high market demand and market requirements to reduce processing steps, reduce material waste and dry manufacturing process.

Such as ultra-fast laser cutting sapphire flakes, can achieve a clean surface, no fragmentation, processing speed fast effect.

Therefore, the development of ultra-fast laser technology will further expand the application field of brittle materials.